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W3079

W3079

Pulse Electronics
RF ANTENNA Bluetooth, WLAN, Zigbee™ Integrated, Chip Solder Surface Mount
Active2,799 in stock

Overview

The W3079 from Pulse Electronics is a high-efficiency dual-band ceramic chip antenna designed for 2.4GHz and 5GHz wireless applications. It provides a compact surface-mount solution for devices requiring Bluetooth, Zigbee, and Wi-Fi connectivity across both frequency bands. Measuring only 3.2mm x 1.56mm, it is ideal for space-constrained IoT designs that must maintain high peak gain.

Why Choose This Part

The W3079 offers a high peak gain of 2.4dBi and a low VSWR of 1.9, ensuring efficient power transfer and extended range. Its ceramic chip construction provides excellent thermal stability from -40C to +85C and mechanical durability compared to PCB trace antennas.

Applications

Dual-Band Wi-Fi Routers and Gateways
Provides efficient radiation for 802.11 a/b/g/n applications operating in both 2.4GHz and 5GHz bands.
IoT Multi-Protocol Nodes
Supports simultaneous or switched connectivity for Zigbee and Bluetooth Low Energy in industrial automation environments.
Wearable Electronics
Low-profile 1.1mm height and small footprint allow integration into compact health trackers and smartwatches.
ISM Band Communication
Effective for short-range radio links in the 2.4GHz and 5.8GHz license-free industrial, scientific, and medical bands.

Key Specifications

Gain 2.4dBi
VSWR 1.9
Termination Solder
Antenna Type Integrated, Chip
Applications Bluetooth, WLAN, Zigbee
Height (Max) 0.043" (1.10mm)
Mounting Type Surface Mount
Frequency Group UHF (2GHz ~ 3GHz), SHF (f > 4GHz)
Frequency Range 2.4GHz ~ 2.48GHz, 5.15GHz ~ 5.85GHz
Number of Bands 2
RF Family/Standard 802.15.4, Bluetooth, WiFi
Frequency (Center/Band) 2.4GHz, 5.5GHz

Getting Started

When integrating the W3079, follow the manufacturer recommended ground plane dimensions and keep-out areas to ensure proper impedance matching. Engineers should use a 50-ohm microstrip feed line and may require a pi-matching network to tune the antenna to the specific enclosure and PCB stack-up.

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