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XC7A100T-1FGG676I

XC7A100T-1FGG676I

Xilinx
Higher-capacity Artix-7 device for applications that outgrow midrange devices and require substantially more logic, memory and DSP resources.
Active3 in stock

Overview

The XC7A100T-1FGG676I is a high-capacity Artix-7 FPGA designed to bridge the gap between low-cost programmable logic and high-performance system requirements. It features 101,440 logic cells, 4,860 Kb of Block RAM, and integrated DSP slices to handle complex signal processing and data-intensive tasks. This industrial-grade device includes hardware-level security features like 256-bit AES encryption and SHA-256 authentication for secure edge deployments.

Why Choose This Part

This FPGA offers a significant leap in logic density and I/O count within the Artix-7 family, making it ideal for designs that have outgrown smaller 35T or 50T devices. The inclusion of integrated GTP transceivers and XADC blocks allows for high-speed serial communication and analog monitoring without external peripheral ICs.

Applications

Industrial Networking
Implementing custom EtherCAT, PROFINET, or Powerlink protocols with low-latency hardware switching.
Professional Video Interfacing
Managing high-bandwidth video pipelines for SDI, HDMI, or DisplayPort conversion and image enhancement.
Sensor Fusion
Aggregating and processing real-time data from multiple high-speed ADCs or image sensors using DSP48E1 slices.
PCIe Expansion Cards
Providing custom hardware acceleration via the integrated PCI Express endpoint for industrial PC systems.

Key Specifications

Mounting Type Surface Mount
Number of I/O 300
Package / Case 676-BGA
Total RAM Bits 4976640
Voltage - Supply 0.95V ~ 1.05V
Number of LABs/CLBs 7925
Operating Temperature -40degC ~ 100degC (TJ)
Supplier Device Package 676-FBGA (27x27)
Number of Logic Elements/Cells 101440

Getting Started

Development is performed using the Xilinx Vivado Design Suite, which supports RTL synthesis and IP-based design flows. For hardware evaluation, the Nexys A7 or similar Artix-7 development boards are recommended to test the XC7A100T core functionality. Engineers should utilize the integrated XADC and Clock Management Tiles to simplify power and timing distribution across the 676-pin BGA footprint.

XC7A100T Family

Comparing specs that differ across variants. The current part is highlighted.

Part Number I/O Pins Package Temp Range Stock
XC7A100T-1FGG676I (this part) 300 BGA-676 -40degC ~ 100degC .. 3
XC7A100T-1CSG324C (AMD (Xilinx)) 210 LFBGA-324 0degC ~ 85degC (TJ) 240
XC7A100T-1FTG256C (Xilinx (AMD)) 170 LBGA-256 0degC ~ 85degC (TJ) 13
XC7A100T-1FGG484C (AMD) 285 BBGA-484 0degC ~ 85degC (TJ) 3
XC7A100T-2FGG484I (AMD) 285 BBGA-484 -40degC ~ 100degC .. 49
XC7A100T-2FTG256I (AMD) 170 LBGA-256 -40degC ~ 100degC .. 45
XC7A100T-1FGG676C (AMD / Xilinx) 300 BGA-676 0degC ~ 85degC (TJ)
XC7A100T-1CS324I (AMD / Xilinx) 210 LFBGA-324 -40degC ~ 100degC 169
XC7A100T-L1FTG256I (AMD / Xilinx) 170 LBGA-256 -40degC ~ 100degC .. 140
Also available as: XC7A100T

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