EmbeddedRelated.com
The 2026 Embedded Online Conference
ZSC-2-1+

ZSC-2-1+

Mini-Circuits
RF Power Divider 100 kHz ~ 400 MHz Isolation (Min) 20dB, 4° Imbalance (Max) Module
Active

Overview

The ZSC-2-1+ is a passive 2-way 0-degree coaxial power splitter and combiner designed for the 100 kHz to 400 MHz frequency range. It features a rugged connectorized module package with BNC connectors, offering high isolation and low insertion loss for VHF and lower UHF signals.

Why Choose This Part

This module provides excellent phase and amplitude balance, with a maximum 4-degree imbalance across its wide bandwidth. Its BNC-connectorized housing allows for rapid integration into existing systems without custom PCB design, and it maintains stable performance from -55C to 100C.

Applications

RF Signal Distribution
Splitting a single RF source to drive two separate receivers or measurement paths with minimal amplitude imbalance.
Signal Combining
Summing two coherent RF signals into a single output while maintaining 20dB minimum isolation between input ports.
VHF Communication Systems
Ideal for maritime, aviation, and industrial radio systems operating in the 100 kHz to 400 MHz bands.
Laboratory Prototyping
Used as a modular block in RF test benches to distribute clock signals or local oscillator feeds.

Key Specifications

Frequency 100 kHz ~ 400 MHz
Insertion Loss 0.6dB
Package / Case Module
Specifications Isolation (Min) 20dB, 4deg Imbalance (Max)
Size / Dimension 2.25" L x 1.38" W x 1.24" H (57.2mm x 35.1mm x 31.5mm)

Getting Started

As a passive component, this device requires no power supply; simply connect 50-ohm terminated BNC cables to the S (sum) and port 1/2 connectors. Ensure all unused ports are terminated with a 50-ohm load to maintain the specified isolation and VSWR performance.

Also Consider

ZFSC-2-1+ Mini-Circuits - Provides similar performance in a different module package style for alternative mounting requirements.
ADP-2-1+ Mini-Circuits - A surface-mount alternative for engineers moving from a modular prototype to a high-volume PCB production design.
The 2026 Embedded Online Conference