Hi, I'm searching for a chip that operates to the high speed USB 2.0 On-The-Go (OTG) standard. We currently use the Cypress FX2 (CY7C68013) to provide a high speed USB 2.0 interface to a host PC and now we would like to add a USB hosting capability that would allow us bypass the host PC and download data directly to a high speed USB 2.0-enable hard disk drive. This application seems very well suited for components that are designed to conform to the high speed USB 2.0 OTG specification. However, so far, I have not been able to locate any readily available OTG components that operate at high speed (480 Mbps). The Cypress CY7C67200 OTG chip only operates at full speed (12 Mbps) and the preliminary documentation on the Phillips ISP1761 claims it will operate a high speed, but there is no datasheet available for review. This indicates that this part is not yet available to the general public and it's not clear how much longer it will be before it is available. Does anyone have any information on available components that are designed to operate to the high speed USB 2.0 OTG specification? Or can any suggest an alternative solution for providing high speed USB 2.0 hosting capability that would not require the addition of several components? Thanks, Brad.
High speed USB 2.0 OTG component availability
Started by ●December 18, 2004
Reply by ●December 18, 20042004-12-18
On 18 Dec 2004 13:00:59 -0800, "Brad S" <bjskill@rocketmail.com> wrote:>Hi, > >I'm searching for a chip that operates to the high speed USB 2.0 >On-The-Go (OTG) standard. We currently use the Cypress FX2 (CY7C68013) >to provide a high speed USB 2.0 interface to a host PC and now we would >like to add a USB hosting capability that would allow us bypass the >host PC and download data directly to a high speed USB 2.0-enable hard >disk drive. This application seems very well suited for components >that are designed to conform to the high speed USB 2.0 OTG >specification. > >However, so far, I have not been able to locate any readily available >OTG components that operate at high speed (480 Mbps). The Cypress >CY7C67200 OTG chip only operates at full speed (12 Mbps) and the >preliminary documentation on the Phillips ISP1761 claims it will >operate a high speed, but there is no datasheet available for review. >This indicates that this part is not yet available to the general >public and it's not clear how much longer it will be before it is >available. > >Does anyone have any information on available components that are >designed to operate to the high speed USB 2.0 OTG specification? Or >can any suggest an alternative solution for providing high speed USB >2.0 hosting capability that would not require the addition of several >components? > >Thanks, >Brad.Does it have to be high speed? By definition all 2.0 devices fall back to full speed if the host cannot handle high speed. Also it is quite legitimate to advertise a device/host as being USB 2.0 compatible, but to not support high speed. After all USB 2.0 is a spec which includes and replaces USB 1.1 spec. The next question is does it need to be OTG? OTG has not really taken off. The additional complexity and lack of other OTG devices (where being host is negotiated to find which of two devices has the "best" driver for the other guy). Being just a host is quite enough of a problem for an embedded software stack. If you do find a part that does it all, let the list know. Regards ~Steve -----------== Posted via Newsfeed.Com - Uncensored Usenet News ==---------- http://www.newsfeed.com The #1 Newsgroup Service in the World! -----= Over 100,000 Newsgroups - Unlimited Fast Downloads - 19 Servers =-----
Reply by ●December 19, 20042004-12-19
> preliminary documentation on the Phillips ISP1761 claims it will > operate a high speed, but there is no datasheet available for review.Write to Philips, they may give you a general public release date. They answered to me some months ago, saying "end of year".> Does anyone have any information on available components that are > designed to operate to the high speed USB 2.0 OTG specification? OrContact also TransDimensions (www.transdimension.com), they're working on the TD2000 part wich is a 2.0 HS embedded host. Not OTG, "just" host. My FAE gave me a preliminary datasheet under NDA, labelled "May 2004". Please, share your findings with the group. I'm going down the same route soon.
Reply by ●December 20, 20042004-12-20
Brad S wrote:> Hi, > > I'm searching for a chip that operates to the high speed USB 2.0 > On-The-Go (OTG) standard. We currently use the Cypress FX2 > (CY7C68013) to provide a high speed USB 2.0 interface to a host PC > and now we would like to add a USB hosting capability that would > allow us bypass the host PC and download data directly to a high > speed USB 2.0-enable hard disk drive. This application seems very > well suited for components that are designed to conform to the high > speed USB 2.0 OTG specification. > > However, so far, I have not been able to locate any readily available > OTG components that operate at high speed (480 Mbps). The Cypress > CY7C67200 OTG chip only operates at full speed (12 Mbps) and the > preliminary documentation on the Phillips ISP1761 claims it will > operate a high speed, but there is no datasheet available for review. > This indicates that this part is not yet available to the general > public and it's not clear how much longer it will be before it is > available. > > Does anyone have any information on available components that are > designed to operate to the high speed USB 2.0 OTG specification? Or > can any suggest an alternative solution for providing high speed USB > 2.0 hosting capability that would not require the addition of several > components? > > Thanks, > Brad.Below is the response I got from Philips back in mid-September about the ISP1761. I have not followed up since then to see if samples are actually available from distributors now. --------------------------------------------------------------------------- Question: What is the availability of the ISP1761 high-speed OTG cotnroller? When will parts be available from distribution? When will samples be available? When will eval kits and development support be available? What will the part cost be in low quantities? --------------------------------------------------------------------------- Philips Semiconductors answer: Robert, Thank you for contacting the Philips Technical Support Center. We have had working samples of the ISP1761 for quite some time and now we expect that it will bereleased to full production at the end of September. At that time, samples will be made available through distribution. We have had working eval boards for several months so these will also be available at the end of September. Regards Paul B
Reply by ●December 20, 20042004-12-20
RobJ wrote:> Brad S wrote: > > Hi, > > > > I'm searching for a chip that operates to the high speed USB 2.0 > > On-The-Go (OTG) standard. We currently use the Cypress FX2 > > (CY7C68013) to provide a high speed USB 2.0 interface to a host PC > > and now we would like to add a USB hosting capability that would > > allow us bypass the host PC and download data directly to a high > > speed USB 2.0-enable hard disk drive. This application seems very > > well suited for components that are designed to conform to the high > > speed USB 2.0 OTG specification. > > > > However, so far, I have not been able to locate any readilyavailable> > OTG components that operate at high speed (480 Mbps). The Cypress > > CY7C67200 OTG chip only operates at full speed (12 Mbps) and the > > preliminary documentation on the Phillips ISP1761 claims it will > > operate a high speed, but there is no datasheet available forreview.> > This indicates that this part is not yet available to the general > > public and it's not clear how much longer it will be before it is > > available. > > > > Does anyone have any information on available components that are > > designed to operate to the high speed USB 2.0 OTG specification?Or> > can any suggest an alternative solution for providing high speedUSB> > 2.0 hosting capability that would not require the addition ofseveral> > components? > > > > Thanks, > > Brad. > > Below is the response I got from Philips back in mid-September aboutthe> ISP1761. I have not followed up since then to see if samples areactually> available from distributors now. >---------------------------------------------------------------------------> > Question: > > What is the availability of the ISP1761 high-speed OTG cotnroller?When will> parts be available from distribution? When will samples be available?When> will eval kits and development support be available? What will thepart cost> be in low quantities? > >---------------------------------------------------------------------------> > Philips Semiconductors answer: > > Robert, > > Thank you for contacting the Philips Technical Support Center. > > We have had working samples of the ISP1761 for quite some time andnow we> expect that it will bereleased to full production at the end ofSeptember.> At that time, samples will be made available through distribution. Wehave> had working eval boards for several months so these will also beavailable> at the end of September. > > Regards > > Paul BRob, Thanks for your comments. I just received the following reply from Phillips: ------------------- Start of Message ----------------------------- Question: Can you please tell me the expected availability date, and its associated datasheet, of the ISP171? We are need of a component that can act as a high speed USB 2.0 host. This component does not have to be OTG compliant, but it would be preferred. I look forward to your response. Sincerely, Brad S. --------------------------------------------------------------------------- Philips Semiconductors answer: Brad, Thank you for your interest in Philips Semiconductors. Attached is the datasheet for the ISP1761. Samples for this part will be available Q1 05. Regards, Chris L ------------------- End of Message ----------------------------- The datasheet they sent me has "Uncontrolled Copy" and "Objective data" markings and a "Company Restricted" waterwark, on every page. I guess they are trying to tell me that these parts are not ready for production. I didn't ask about the availability of evaluation boards, but I assumed, based on the reponse you received from Phillips, that there will be boards available for purchase sometime in Q1 of '05. Brad S.
Reply by ●December 20, 20042004-12-20
Steve, Yes, the part must support high speed USB 2.0 transfers. Ideally, we would like to be able to maintain a sustain transfer rate of 40 MB/s (320 Mbps). I don't know if this transfer rate is realistically possible but, so far, I haven't been able to find a lot of choices for developing a high speed USB 2.0 host in an embedded system. This part does not have to support the OTG spec. If there is a part out there that will provide a high speed USB 2.0 hosting capability without adding a lot of complexity (components and/or software), then it would love to hear about it. Thanks for your comments. Brad S.
Reply by ●December 20, 20042004-12-20
On 20 Dec 2004 12:34:18 -0800, "Brad S" <bjskill@rocketmail.com> wrote:>Steve, > >Yes, the part must support high speed USB 2.0 transfers. Ideally, we >would like to be able to maintain a sustain transfer rate of 40 MB/s >(320 Mbps). I don't know if this transfer rate is realistically >possible but, so far, I haven't been able to find a lot of choices for >developing a high speed USB 2.0 host in an embedded system. > >This part does not have to support the OTG spec. If there is a part >out there that will provide a high speed USB 2.0 hosting capability >without adding a lot of complexity (components and/or software), then >it would love to hear about it. > >Thanks for your comments. > >Brad S.Hi, ok you need high speed. I doubt if you can maintain 40 MB/s in any case. Have you tried a USB drive under windows to see the max speed it gets? I have heard that the highest data rate under Linux is about 30MB/sec. The drives themselves cannot sustain too high a rate once they run out of cache, YMMV. The highest theoretical data rate for HS is somewhere between 52 and 56 Mbit per second. Depending on your HS controller and its memory interface you may get much less. What kind of embedded system are you using? If you are doing a SOC system on an ASIC, ARC/Transdimensional sells a USB 2.0 core. Otherwise to maintain that kind of data rate you will have to use a recent x86 motherboard with a decent chipset that provides USB 2.0. Regards, ~Steve -----------== Posted via Newsfeed.Com - Uncensored Usenet News ==---------- http://www.newsfeed.com The #1 Newsgroup Service in the World! -----= Over 100,000 Newsgroups - Unlimited Fast Downloads - 19 Servers =-----
Reply by ●December 20, 20042004-12-20
> Yes, the part must support high speed USB 2.0 transfers. Ideally, we > would like to be able to maintain a sustain transfer rate of 40 MB/s > (320 Mbps). I don't know if this transfer rate is realistically > possible but, so far, I haven't been able to find a lot of choices for > developing a high speed USB 2.0 host in an embedded system. > > This part does not have to support the OTG spec. If there is a part > out there that will provide a high speed USB 2.0 hosting capability > without adding a lot of complexity (components and/or software), then > it would love to hear about it. > > Thanks for your comments. > > Brad S.USB OTG has other limitations. The current provided to the other end is severly limited. For full speed, I think it is 12 mA IIRC. I do not know if Hi Speed will allow higher currents. You may want to check this. Current USB memories use a lot more than 12 mA. -- Best Regards, Ulf Samuelsson ulf@a-t-m-e-l.com This is a personal view which may or may not be share by my Employer Atmel Nordic AB
Reply by ●December 20, 20042004-12-20
Ulf, We are intending to place a restriction on our HS USB 2.0 port that will require any device that connects needs to be self-powered. Our current requirements will not require our host port to supply current to an external device (e.g. USB 2.0 HDD). That being said, requirements have a funny way of changing......after the design has been completed and been turned over for PCB layout. Hopefully, that won't happen, but we probably should look into the current restrictions so we can be prepared in case that issue comes up. Brad S.
Reply by ●December 20, 20042004-12-20