Which MCU has these features?

> > So it is not cost-effective (external chip vs. on-die memory) to make
> > large memories on the same die as the processor. Once you cross-the
> > break-even point mentioned above, the only options are stacked modules
> > or side-by-side hybrids. These devices are undesirable due to poor
> 
> Not so much worried about cost as power. I'm hoping more for 90nm

You might not be, but the chip vendors are! Unless there are special
app-specific constraints, they won't make an integrated device that is
more expensive than multidie solutions...